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2007/12/21/15:45
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| QUICK BGA2015 Rework System |
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Feature:
BGA rework system uses micro-processor control and infrared sensor technology to do soldering and desoldering to surface mounted components safely and accurately. It consists of QUICK IR2015 Infrared Rework System and QUICK PL2015 Precision Placement System.
*The soldering and desolding process are both under the monitoring of non-contact infrared sensor to get the optimum and reproductive PCB temperature
*The technology of controlling reflow soldering by looped circuit ensures precise temperature window, even heat distribution and suitable peak value of temperature.
*The adjustable aperture can protect the adjacent components (which is sensitive to the temperature) on PCB from being heated. No need for nozzles.
*The use of reflow process camera supplies the critical message to judge the melting situation of solder materials during the whole soldering and desoldering process.
*It can deal with PCB with big thermal capacity and other high temperature situation easily (For example, lead-free soldering). |
(Click photo for more information) | | Main Parts:
1. IR 2015 Infrared Reflow Soldering Section
Infrared temperature sensor monitors BGA surface temperature to ensure precise temperature technical window.Even heat distribution,real closed-loop control.
2. IRsoft Software
By means of PC,the whole process can be recorded,controlled and analyzed and then generate the curve diagram to meet the damands of modern electronic industry.
3. PL2015 Precision Aligning and Placing system
Visible double-clolor optical alignment.Accurate alignment and overlap between solder ball and soldering pad;Easy to control and place components
4. RPC2015 Reflow Camera
The melting course of BGA solder ball can be observed from different angles which provides critical information to get accurate and reliable process curve.
QUICK 2015 Specifications:
IR Infrared Rework System:
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General Power |
3000W(MAX) |
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Power of Bottom Heater |
500w*4=2000w or 400w*4=1600w(High Infrared heating tube/Dark Infrared heater optional) |
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Power of Top Heater |
180w*4=720w(Infrared heating tube, wavelength about 2~8μm) |
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Size of Top Heater |
60*60mm |
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Size of Bottom Heater |
267*280mm |
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Adjusting Range of Top Heater |
20~60mm(X、Y direction both adjustable) |
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Vacuum Pump |
12V/300mA, 0.05 Mpa (max) |
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Top Cooling Fan |
12V/300mA 15CFM |
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Laser Alignment Tube |
3V/30mA |
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Moveable Motor |
24VDC/100mA |
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Moveable Arm Range |
93mm |
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Max PCB Size |
420*500mm |
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LCD Display Window |
65.7*23.5mm 16*2 alphabet |
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Communication |
RS-232C (connect with PC) |
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Infrared Temperature Sensor |
0~300℃(Testing Range) |
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Outside K type Sensor |
Optional | PL Precision Placement System:
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Power |
About 15w |
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Camera |
22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PLA format |
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Size of BGA to be aligned |
60mm*60mm |
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LED Lighting |
White LED (lower side), Red LED (upper side) (brightness adjustable) |
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Vacuum Pump |
12V/600mA 0.05Mpa(max) |
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Camera Output Signal |
Video Signal |
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Weight |
22Kg | RPC Reflow Soldering Process Camera:
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Power |
About 15w |
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Camera |
22*10 times magnifying; 12V/300Ma; Horizontal resolution: 480 TV lines; PAL format |
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LED Lighting |
White LED (brightness adjustable) | NOTE:
Without additional notice if above parameters change.
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Contact us
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SUJUN ELECTRONIC CO.,LTD.
Add:236#, WUjin High-Tech Development Zone, Jiangsu
TEL: 86-519-85057999 86576372
FAX: 86-519-86558599
Email:
overseas@quickchina.com.cn
P.C.: 213161
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| English 
